Multilayer flexible circuit Types

1. Finished flexible insulating substrate

This category is manufactured on a flexible insulating substrate and the finished product is specified to be flexible. This structure usually bonds the two sides of many single-sided or double-sided microstrip flexible PCBs together, but its central part is not bonded together, so it is highly flexible. In order to have a high degree of flexibility, a thin, suitable coating such as polyimide can be used on the conductor layer instead of a thicker laminate cover.

2. Finished flexible insulating base material

This category is manufactured on a flexible insulating substrate and the finished product is specified to be flexible. This type of multi-layer FPC is made of soft insulating materials, such as polyimide film, laminated into a multi-layer board, which loses its inherent flexibility after lamination.

Multilayer flexible circuit Board Sample

This is the 6 layer flex circuit board pictures. The 6 layers fpc use the half-hole (Castellated Hole) Design.

Multilayer flexible circuit board Advantage

1. Flexibility, multilayer flexible circuit boards can be bent and folded freely, and multilayer flexible circuits will not be damaged after tens of thousands of twists and turns. Multilayer flex circuit boards can be arranged arbitrarily according to the spatial layout, stretched and moved arbitrarily in three-dimensional space, and realizes the integration of component assembly and wiring, with high flexibility.

2. The multilayer flexible circuit board is thin and flat, which makes the structure and layout of the equipment more compact and reasonable, reduces the product volume, reduces the weight, and is easy to carry, which promotes the development of high density, high reliability and miniaturization of electronic products.

3. Strong safety, because the wires of the multilayer fpcs are connected as a whole, and various parameters are highly consistent, which can reduce errors in wire assembly and connection, and reduce the occurrence of failures.

4. High assembly reliability, the flat wiring of the multi-layer flex circuits can reduce switch interconnection, facilitate circuit design, reduce assembly work, improve the reliability of the entire system, and facilitate fault detection.

5. Design flexibility. Inductance, capacitance, characteristic impedance, etc. will affect the transmission of the product. The design of the flexible circuit board is controllable and has excellent electrical performance. Multilayer Flexible PCB can be designed as a controllable high-power parameter with transmission line characteristics.

6. Multilayer Flexible PCB has good heat dissipation, solderability and easy installation and connection. There are various base materials, and different base materials can be used according to different requirements.

Multilayer flexible circuit board manufacturing processing

The method of multilayer FPC is to use a "core board" structure to achieve higher density interlayer interconnection. This multi-layer core board lamination method uses conventionally produced high-density impedance boards or FPC boards with leading edge density as the "core board". Then on one side or both sides of the "core board", 1 to 4 layers of flexible circuit boards with higher density interlayer electrical interconnections are built up.

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